Universidad Politecnica Salesiana and the IEEE Andean Council have the honor of inviting you to the international conference: ANDESCON 2020, an event that brings together professionals and scientists from the Institute of Electrical and Electronic Engineers (IEEE) from Andean countries, Venezuela, Ecuador, Peru, Bolivia and Colombia. However, people from all over the world can send their papers.

 

 

Because of the current situation around the world, and the request to reduce travelling to stop COVID-19, the Organizing Committee of IEEE ANDESCON 2020, in agreement with the Executive Committee and the Andean Council IEEE, has decided that the conference will be done virtually and not in person.

 

Presentation of articles: Articles must be sent in digital format (PDF) through the submission web site. Papers must be written in English in the required IEEE conference format. The maximum length is six (6) pages per article, including illustrations and references. Papers that are accepted will be published in the conference proceedings and will be sent to be included in the IEEE Xplore Digital Library. All previous Andescon editions that complied with SCOPUS guidelines have been included in this index.

 

For every paper that is accepted, at least one of the authors must register and present the paper in the conference; if a paper is not presented, it will not be included in IEEE Xplore. All documents will be analyzed using anti plagiarism software tools.

 

 

- Deadline to send papers: May 30th, 2020

 

- Notification that your paper was accepted: July 20th 

 

- Deadline to present the final paper: August 15th 
 

- Conference: October 13th - 16th, 2020

 

 

Send your work through the following link: https://bit.ly/2VG9MLG  

 

• LEARN MORE ABOUT ANDESCON 2020

For more information contact:

Germán Arévalo 

garevalo@ups.edu.ec

Mónica Huerta

mhuerta@ups.edu.ec

Website: https://attend.ieee.org/andescon

Facebook: https://www.facebook.com/IEEEandescon/